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Molex Introduces Unique Ultra-Compact SlimStack B8 Connectors

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Specializing in the sales of: Connectors | Wire Harness | Cable Products

Molex Incorporated, a provider of a full range of interconnect products, introduces the SlimStack™ B8 connector with a robust housing and unique CleanPoint™ contact characteristics that eliminate the ingress of solder flux and other contaminants to ensure outstanding electrical reliability. The compact SlimStack B8 0.40 mm pitch SMT board-to-board connectors feature a 0.80 mm height and ultra-narrow 2.50 mm width, providing space savings for high-end medical, consumer electronics and data/telecom mobile device applications.

During the production of flexible board-to-board patch cords, flux or dust can sometimes land on the contacts and interrupt signal continuity," said Mike Higashikawa, product manager, Molex. As mobile devices continue to increase in value and complexity, OEM customers need to ensure that a stable power connection is maintained to avoid costly rework or repair. In the SlimStack B8 connector system, all of the built-in features have been designed and manufactured for mobile device reliability." The SlimStack B8 connector leverages the proven benefits of the Molex SlimStack portfolio and includes the new, application-pending CleanPoint contact design with a beveled shape that provides a wider, more consistent clean path and more stable signal than other connectors used in mobile applications.The CleanPoint contact and redundant dual-contact terminals To help ensure safe contact and avoid continuous drop impacts in the event of a drop or high vibration handling, the SlimStack B8 assembly method, including a top shell wall (block) design with a solid metal cap, provides greater protection against damage caused by "snap-on" or angled forceful pull-outs. In the case of angled pull-outs or blind insertions, the metal cover spikes protect the shell from damage. Mating tests on the outer wall of SlimStack B8 connectors have proven that the shells are not damaged by forces of up to 50 N and displacements of up to 0.80 mm. Reliable mechanical features for ease of use, such as clicking tactility during mating and a strong retention force, are used to further enhance contact stability," added Higashikawa. "The ultra-compact SlimStack B8 connector is the connector of choice for mobile devices and other electronics in applications that require strong signal integrity and shell protection, such as higher-end mobile devices, or for applications that require strong signal integrity and shell protection, such as higher-end mobile devices. such as higher-end mobile devices, or where there is a need to prevent flux contamination that can occur on flexible board-to-board patch cables." Molex's SlimStack product line, the manufacturing industry's broadest line of ultra-small and miniature SMT board-to-board connectors, offers design engineers numerous space-saving options for applications such as cell phones, digital cameras, laptops, tablets and other mobile devices.

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