Categorization:Product Information
I. Does plating of a pin bar busbar improve electrical performance? One of the primary requirements for the electrical performance of a pin and busbar is to establish and maintain a stable pin and busbar impedance. To accomplish this, a metallic contact interface is required to provide this inherent stability. Establishing such a contact interface requires a surface film that can be avoided or split during the contact fit. These two different options clarify the distinction between precious or rare metals and common metals. To varying degrees, precious metal coatings (e.g., gold, palladium, and their alloys) are by their very nature free for surface films. For these coatings it is relatively simple to produce interfacial metal contact, since it requires only the movement of the concomitants of the contacting surfaces during mating. This is usually easily achieved. In order to maintain the stability of the impedance of the contact interface, the design of the pin and busbar requires that care should be taken to maintain the precious metal nature of the contact surface to prevent the effects of external factors such as contaminants, diffusion of the substrate metal, and contact wear. Ordinary metal plating, especially tin or tin alloy, its performance are naturally covered with a layer of oxide film. Tin contact plating works because this oxide layer is easily destroyed during mating so that metal contact can be easily established. The need for a pin and busbar design is to ensure that the oxide film breaks down when the pin and busbar are mated, while ensuring that the contact interface is no longer oxidized during the lifetime of the electro-connecting adherent. Re-oxidizing corrosion, in the case of abrasion corrosion, is the dominant performance degradation mechanism for tin contact coatings. Pin row mother silver contact plating is better treated as a common metal plating, because the coating is vulnerable to corrosion by sulfides and chlorides. Nickel plating is also usually treated as a common metal due to the formation of valve warps.
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