How can I improve the testing accuracy of my instrument?

As a leading original equipment manufacturer of semiconductor test equipment, our client's core competency lies in the research, development and innovation of integrated circuit (IC) test equipment. Their more advanced and patented technologies enable chip manufacturers to accurately screen out defective and faulty products in semiconductor chips through automated inspection of packaged semiconductor chips to ensure the quality of products shipped to the market. Since its inception in 2008, the client has expanded its business in China, Hong Kong, Taiwan, Japan and Singapore, and has been listed on the Shenzhen Stock Exchange. Semiconductor chips have greatly impacted the electronics industry and revolutionized our lives. From home applications to devices such as cell phones, tablets, laptops and TVs, semiconductor chips have changed the way consumers work and play! Due to the impossible yields achieved during semiconductor manufacturing, inspection of chips is necessary and directly impacts the final chip cost, as even minor defects can lead to product failure.

I. What is used for semiconductor chip testing in conjunction with automated test equipment (ATE)?

Semiconductor chip testing is performed using test systems and test processors combined with automated test equipment (ATE). After individual chips are packaged, they are put through package test, also known as final test. The test processor automatically moves each chip to an ATE terminal to check that no chips were damaged during the packaging process, and then the test measures the expected performance for its use. This seemingly simple process, where every step is automated, relies heavily on the electronics in the application to ensure the accuracy of the test results.

(b) (i) How to solve poor contact between printed circuit boards?

Due to poor contact between printed circuit boards, customers struggle to ensure data accuracy when using low-end connectors. The connector's terminal construction design, low vibration tolerance, etc. lead to signal loss in complex applications. ERNI | ERNI has a great solution. ERNI has always had a strong presence in the instrumentation industry, and our extensive experience and knowledge base gives us a competitive advantage over other manufacturers. It's no coincidence that our customers look to ERNI as a global innovator and supplier of high-quality electronic connectors. ERNI's ERmet 2.0 mm hard metric and ERmet ZD connectors comply with the international industrial connector standard, IEC 61076-4-10, and are used in a wide range of high-speed applications in the telecom and datacom industries. The connector system has also gained wide acceptance and popularity as an interconnect system for CompactPCI®Express and PXI Express.

III. Introduction to ERmet 2.0 mm hard metric:

ERmet 2.0 mm hard metric connectors can support a variety of PCB layouts, including daughtercard, expansion card, backplane, and board-to-board applications. The signal contacts of these female connectors feature a double-bar blade design that provides a balanced signal path length for high signal performance.

IV. ERmet 2.0 mm hard metric features:

1. Available contact arrays include signal, high power, high frequency and coaxial circuits designed for versatility 2. Selectable pin numbers and positions 3. Coded keys

V. Introduction to ERmet ZD:

ERmet ZD high-speed connectors allow data rates of 20 or 25 Gbit/s with excellent signal integrity. The rugged design ensures high vibration and heat resistance in complex applications.ERmet ZD connectors meet the electrical performance requirements for high-speed, low-voltage differential signals. The grid layout also allows these high-speed connectors to be integrated with ERmet 2.0 mm hard metric.

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