Categorization:Product Information
RJ45 connector network interface is divided into many specifications, today's RJ45 connector manufacturers ship more types are: RJ45 connector 90 degrees plug board type with LED lights / no lights, RJ45 connector 180 degrees straight plug with lights / no lights, RJ45 countersunk board plug board type, RJ45 double side-by-side, RJ45 dual / with USB interface, etc. 1. contact resistance: with male and female seat mating, and then use the Current greater 100mA voltage greater 20mV to measure and record the contact impedance.2. Insulation resistance: 1 minute 500 VDC after the measurement of mating and unmated connector assemblies between the adjacent contacts of the insulation resistance.3. Withstand voltage: unmated connector assemblies between the adjacent contacts to test: Voltage: 500 VDC Leakage current: 5.0 mA greater.4. Insertion force: connector assemblies Insertion force: Connector assemblies in which the measured force is greater must be at 12.5 mm/min.5. Durability: Mating and unmating connector assemblies 750 cycles at a higher rate of 20 times/min.6. Temperature resistance test: Tests shall be conducted at a temperature of 85 ℃ 兾 2 ℃ for a period of 96 hours. After the test items should be placed in standard atmospheric conditions for 1 hour before measuring the action 7. Constant temperature and humidity: 90% ~ 95% relative humidity RH, temperature 40 ℃ earth 2 ℃, 96 hours for the test. After the test items should be placed in the standard atmospheric conditions for 1 hour before the measurement action 8. smoke test: to 5 earth 1% salt water concentration; temperature 35 +1 + ℃ / -2 ℃ , time 16 hours for the test 9. tin eating: the terminal foot immersed in Rtype flux 5-10 seconds, and then immersed in the terminal foot in the 245 ℃ 士5 ℃ of the tin furnace for 4.0 ~ 5.0 seconds 10. resistance to soldering: Reflow soldering conditions: preheating plating surface temperature should reach 180 ℃, 2 Shi + 03 minutes after the circuit board into the reflow soldering equipment, reflow soldering temperature plating surface temperature higher for 260 Shi 5 ℃ and stay no more than 10 seconds after the circuit board into the low-temperature soldering place.
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