As a variety of precision electronic products continue to increase, the limited space needs to be smaller precision connectors to meet the requirements for electronic products, such as smart phones, now more and more inclined to the development of thin and light and high performance, making the cell phone display components and the substrate connection is more complex, the demand for cell phone board-to-board connectors have begun to shift to a narrower pitch, low height and multi-polarization. Board-to-board connector flexibility and transmission performance as well as miniaturization, thin features can be well adapted to the development of smart phones, can effectively maintain a strong connection, but also to a greater extent to reduce the thickness of the body of the phone. In board-to-board connector testing, board-to-board high-current shrapnel micropin modules can well meet the test requirements. As a strong conduction function of the transmission medium, high-current shrapnel micro-pin module from the shape of the structure has occupied the advantage, one-piece molding shrapnel structure, gold-plated and hardened processing, you can enhance the conductive properties, no current attenuation in the transmission process, electrical stability, has a very good connection function.
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