Connector gold plating layer color inconsistency analysis

1. The influence of impurities in plating raw materials: when the impurities brought in by the chemical materials added to the plating solution exceed the tolerance level of the plating solution, the color and brightness of the gold layer will be affected very quickly. If it is organic impurities will appear in the gold layer darkening and blossoming phenomenon, Haoer trough test piece to check the darkening and blossoming position is not fixed. If the metal impurities interfere with the current density will cause the effective range of narrow, Hall tank test shows that the low end of the test piece current density is not bright or the high end of the plating is not bright and the low end of the plating can not be. Reflected in the plated parts is plated red or even black, the color change in the hole is more obvious. 2. plating current density is too large: due to the plating tank parts of the total area of the calculation error of its value is greater than the actual surface area, so that the amount of plating current is too large, or the use of vibration electroplating its amplitude is too small, so that all or part of the plated parts of the groove of the gold plating layer of crystalline roughness, visual redness of the layer of gold. 3. plating solution aging: plating solution is too long a period of time, then the plating solution in the over-accumulation of impurities will inevitably result in the color of the layer of gold is not normal. 4. Hard gold plating in the alloy content changes: in order to improve the hardness of the connector and wear-resistant degree, the connector gold plating is generally used in hard gold plating process. Which use more gold-cobalt alloy and gold-nickel alloy. When the plating solution of cobalt and nickel content changes will cause the color of the gold plating layer changes. If the cobalt content in the plating solution is too high the color of the gold layer will be red; if the nickel content in the plating solution is too high the color of the metal will become lighter; if the plating solution in this change is too large and the same supporting the different parts of the product is not in the same groove plating, so there will be the same batch of products provided to the user the color of the gold layer of the phenomenon is not the same. 5. hole plating is not on the gold: plug pins or jacks of the connector after the completion of the gold-plating process, the thickness of the outer surface of the plated parts to reach or exceed the specified thickness value, its welding line holes or jack holes in the inner holes of the plating layer is very thin or even no gold layer. 6. plated pieces of the plated parts of each other: in order to ensure that the jacks of the connector jacks in the jacks in the plugging and pulling the use of a certain degree of elasticity, in the design of the majority of types of products are designed to be the jacks are in the mouth design of a cleavage groove. In the plating process, the plated parts are constantly turning part of the jacks in the openings are inserted together with each other, resulting in the insertion of parts of the power line to screen each other, resulting in plating difficulties in the holes. 7. plated when the plating of the plated parts of the first and last: some types of connectors and their pins in the design of the pin bar of the outer diameter of its dimensions are slightly smaller than the diameter size of the welding wire holes, in the plating process of the middle portion of the pins will form a first and last resulting in the plating of welding wires inside the holes can not be plated into the gold. The above two phenomena are more likely to occur in the vibration gold plating. 8. Blind hole parts of the concentration of larger than the plating process deep plating capacity: due to the bottom of the split groove in the jack from the bottom of the hole there is a distance, this distance objectively formed a section of the blind holes. Similarly, in the pin and jack of the welding wire holes also have such a blind hole, it is to provide wire soldering when the guiding role. When these holes in the hole diameter is small (often less than 1 mm or even less than 0.5 mm) and the concentration of blind holes more than the diameter of the hole when the plating solution is difficult to flow into the hole, flow into the hole of the plating solution is difficult to flow out, so it is difficult to ensure the quality of the gold layer in the hole. 9. Plating the anode area is too small: when the volume of the connector is smaller than the relatively small single-slot plating of the total surface area of the piece is larger, so that when plating the small pinhole pieces, if a single-slot plating pieces are more. The original anode area is not enough. Especially when the platinum-titanium mesh use time is too long platinum loss is too much, the effective area of the anode will be reduced, which will affect the deep plating ability of gold plating, plating pieces of holes will not be plated into. 10. Poor plating bonding: in the plating test plug-in plating bonding, sometimes encountered in part of the pin end of the needle front in the bending or pinhole pieces of the weld line holes in the flattening of the plating layer has a skin phenomenon, and sometimes in the high temperature (2,000 hours) test test found that the gold layer has a very small bubble phenomenon occurs. 11. Pre-plating is not complete: For small pinhole pieces, if the machining sequence is completed after the inability to Immediately after the machining sequence, if the trichloroethylene ultrasonic degreasing cleaning, then the next conventional pre-plating treatment is difficult to remove the dried oil inside the hole, so that the hole in the plating will greatly reduce the bonding force. 12. Incomplete activation of the substrate before plating: in the connector substrate materials in a large number of various types of copper alloys, these copper alloys of iron, lead, tin, beryllium and other trace metals in the general activation of the liquid is difficult to make its activation, if not using the corresponding acid will be activated, in the electroplating, these metal oxides and the plating is very difficult to combine, which caused the plating of the phenomenon of high-temperature blistering. 13. Plating solution concentration is low: in the use of ammonia sulfonic acid nickel plating solution Low concentration of plating solution: when using nickel aminosulfonate plating solution for nickel plating, when the nickel content is lower than the process range, the quality of plating inside the holes of small pinhole parts should be affected. If the gold content of the pre-plating solution is too low, then in the plating of gold holes may not be plated gold, when the plated parts into the thickening of the gold plating solution, the holes in the hardware layer of the plated parts in the holes of the nickel layer has been passivated as a result of the holes in the gold layer of the bonding of nature is poor. 14. slender shape pins plating without lowering the current density: in the plating of slender shape pins, if plated according to the usual use of remote current density, the tip of the needle parts of the plating layer will be much thicker than on the needle bar, under a magnifying glass to observe the tip of the needle will be sometimes Dan match-head shape. The head and neck of the plating that is the top of the front of the pin back a little bit of the part of the gold plating test bonding is not qualified. This phenomenon is easy to vibration gold plating. 15 vibration gold plating vibration frequency adjustment is not correct: the use of vibration plating plating connector, if the nickel plating vibration frequency adjustment is not correct plating jump too fast, easy to open into a double layer of nickel on the plating of the bonding effect is very large.

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