How to prevent interference problems with connectors

1. Coupling and propagation of noise: Common mode noise is generated by irrational design. Some typical causes are different lengths of individual wires in different pairs, or different distances to the power supply plane or chassis. Another cause is defective components, such as magnetic induction coils with transformers and capacitors with active devices (e.g., application-specific integrated circuits (ASICs)). 2. Common-mode noise in the I/O region: Set decoupling capacitors immediately adjacent to the load; fast-varying pulsed currents with rapidly varying forward and backward edges with the smallest possible loop sizes; keep high-current devices (i.e., drivers and ASICs) away from the I/O ports; determine the signal integrity to ensure that overshoot and undershoot are minimized, especially for high-current critical signals (e.g., clocks, buses); use localized filtering, such as RF ferrite, which absorbs RF interference; and provide low-impedance laps to the baseboard or references in the I/O region on the baseboard. RF Noise and Connectors. 3. EMI connectors were selected for the following reasons: conductive foam plastic is extremely flexible and can be placed around the entire perimeter of the connector. This eliminates problems associated with another enclosure, the liner; the mechanical engineer can install the connector within tolerances acceptable to the system enclosure; the connector achieves a low impedance lap to the enclosure to ensure good contact. Housing wall on the inside of the liner, when to be painted with masking requirements, can be more flexible material; require forced cooling design, the liner better have another feature: between the connector and the wall of the housing should be sealed up to minimize air leakage. In dusty environments, the liner should serve to keep the system clean.

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