How should plating be properly selected for RF connector design?

　Choosing the right plating design for an RF connector is critical because plating affects RF connector performance, lifecycle, quality and cost. RF connector pins and plating are often the main cost drivers for RF connector systems. The following article focuses on how to choose the right plating for RF connector design by looking at the 2 common plating metals used in RF connector pins, gold plating and tin plating.　　There are many factors to consider when choosing the right plating when designing an RF connector, but the better choice of plating is to meet the system requirements at a lower cost, make sure it works to your quality design specifications, but don't over-design the plating. The plated metal in the RF connector pins can be divided into 2 types: gold plated and tin plated.1. Gold Plated: Gold plated is usually used for high reliability, low current applications and high cycle applications because it is robust and has excellent wear resistance. Its cobalt alloying increases hardness and is very adaptable for use in harsh environments, but because it does not contain oxides, this can lead to increased contact resistance. Gold plating is a precious metal, which means it is not as affected by the environment.2. Tin plating: Tin is a lower cost alternative to gold and has excellent solderability. Unlike gold, tin is not a precious metal. Tin plating begins to oxidize the instant it is exposed to air. As a result, tin-plated contact systems require greater normal force and a longer contact wipe area to penetrate this oxidized film. Most importantly, tin plating is better suited for applications with fewer cycles because it is a softer metal, allowing for a perfect release of the extra force applied to the contact.　　Additionally gold plating requires a lower normal force compared to tin plating, and for fine pitch RF connectors it is difficult to find room to design thick contact beams with a lot of deflection to generate the normal force required by tin. Therefore, due to physical size constraints, gold plating is often the available option. In other words, tin is generally used if available, since tin plating is used in RF connector contact areas where proper normal force can be generated, and in benign environments. If the tin plating oxidizes, a significant amount of normal force and contact wiping is required to break through the inherent oxide layer.　　In summary gold plating is used for high reliability, high cycle, low voltage applications and tin plating is used for applications with fewer cycles, is less expensive and can be soldered. The choice of plating gold in the contact fit area and tin on the tail is usually the better choice.

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