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Optimization of electrical performance can be considered in terms of the control of the already existing and soon to be formed films located on the surface of the contact plating. One of the main requirements for the electrical properties of the pinning is the establishment and maintenance of a stable pinning impedance. To accomplish this, a metallic contact interface is required to provide such inherent stability. Establishing such a contact interface requires a surface film that can either avoid or split during the contact fit. These two different options clarify the distinction between precious or rare metals and common metals.
To varying degrees, precious metal coatings (e.g., gold, palladium, and their alloys) are intrinsically free to the surface film. For these coatings it is relatively simple to produce interfacial metal contact, since it requires only the movement of the contacting surface's concomitants during mating. Usually this is easily achieved. In order to maintain the stability of the impedance at the contact interface, the design of the needle arrangement requires that care be taken to maintain the precious metal nature of the contact surface to protect it from extraneous factors such as contaminants, diffusion of the substrate metal, and the effects of contact abrasion.
Ordinary metal plating, especially tin or tin alloys, is naturally covered with a thin film of oxide. The tin contact coating is useful because this oxide layer is easily broken during mating so that metal contact can be easily established. The need for pin design is to ensure that the oxide film breaks down when the pins are mated and that the contact interface is not oxidized again during the lifetime of the electro-connecting retainer. Re-oxidizing corrosion, in the case of abrasion corrosion, is the dominant performance degradation mechanism for tin contact coatings. Silver contact coatings are best treated as common metal coatings because of the susceptibility of the coating to corrosion by sulfides and chlorides. Nickel plating is also usually treated as a common metal due to the formation of valve warps.
Knowledge about plating of pin and busbar. Most of the electronic connectors, terminals have to make the surface treatment, generally refers to plating. There are two main reasons: one is to protect the terminal reed substrate from corrosion; the second is to optimize the performance of the terminal surface, the establishment and maintenance of the contact interface between the terminals, in particular, the film layer control. In other words, to make it easier to achieve metal-to-metal contact. Preventing corrosion: Most connector reeds are made of copper alloys, which usually corrode in the environment in which they are used, such as oxidation and vulcanization. Terminal plating is to isolate the reed from the environment and prevent corrosion from occurring. Plated materials, of course, if not corrosion, at least in the application environment. Optimization of terminal surface properties can be achieved in two ways. One is in the design of the connector, to establish and maintain a stable terminal contact interface. The second is to establish a metallic contact that requires any surface film layer to be absent or ruptured during insertion. The difference between the two forms of absence and rupture of the film layer is also the difference between precious metal plating and non-precious metal plating. Precious metal plating, such as gold, palladium, and their alloys, is inert and has no film layer of its own. Therefore, for these finishes, metallic contact is "automatic". What we need to consider is how to maintain the "nobility" of the terminal surface from external factors such as contamination, diffusion of the substrate, terminal corrosion, etc.
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