What are the reasons for differences in connector gold plating?

1. The influence of impurities in plating raw materials when the impurities brought in by the chemical materials added to the plating solution exceed the tolerance level of the plating solution will soon affect the color and brightness of the gold layer. If it is organic impurities will appear in the gold layer darkening and blooming phenomenon, Haoer groove test piece to check the darkening and blooming position is not fixed. If the metal impurities interfere with the current density will cause the effective range of narrow, Haoer trough test shows that the low end of the test piece current density is not bright or the high-end plating is not bright low-end plating can not be. Reflected in the plated parts is plated red or even black, the color change in the hole is more obvious. 2. plating current density is too large due to the plating tank parts of the total area calculation errors in the value is greater than the actual surface area, so that the amount of plating current is too large, or vibration electroplating amplitude is too small, so that all or part of the plated parts of the groove of the gold plating layer crystallization roughness, visual redness of the layer of gold.

3. gold-plated liquid aging gold-plated liquid use time is too long, the plating liquid impurities excessive accumulation will inevitably cause the gold layer color is not normal. 4. hard gold plating in the alloy content changes in order to improve the hardness of the connector and wear-resistant degree of connectors are generally used in the plating of hard gold-plated process. Which use more gold-cobalt alloy and gold-nickel alloy. When the plating solution of cobalt and nickel content changes will cause the gold plating layer color change. If the cobalt content in the plating solution is too high the color of the gold layer will be red; if the nickel content in the plating solution is too high the color of the metal will become lighter; if the plating solution in this change is too large and the same supporting the different parts of the product is not in the same slot plating, so there will be the same batch of products provided to the user the color of the gold layer of the phenomenon is not the same. 5. holes plated with no gold connector pins or jacks plating process is completed after the completion of the thickness of the outside surface of the plated parts Reach or exceed the specified thickness value, its welding line hole or jack hole plating layer is very thin or even no gold layer. 6. plated parts plated against each other in order to ensure that the connector's jack in the jack in the use of plug and pull a certain degree of elasticity, in the design of most types of products are designed in the mouth of the jack is a split groove. In the plating process plated parts constantly turning part of the jacks in the openings are inserted together with each other, resulting in the insertion of parts of the power cord each other screened, resulting in plating difficulties in the holes. 7. plated parts plated with the end of the first and the end of some types of connectors its pin in the design of the outer diameter of its needle bar size is slightly smaller than the aperture size of the welding wire hole, in the plating process of middle part of the pins will be formed in the first and the end of the first and the end of the welding wire holes caused by the plating of the gold can not be into the gold. 8. Blind holes in the parts Concentration is greater than the plating process deep plating capacity due to the bottom of the split slot in the jack from the bottom of the hole there is a distance, this distance objectively formed a section of blind holes. Similarly in the pins and jacks in the welding wire holes there is also such a section of blind holes, it is to provide wire welding when the guiding role. When these holes in the hole diameter is small (often less than 1 mm or even less than 0.5 mm) and blind hole concentration over the hole diameter when the plating solution is difficult to flow into the hole, flow into the hole of the plating solution is difficult to flow out, so the hole in the gold layer is difficult to ensure the quality of the 9. Plating the anode area is too small when the volume of the connector is smaller than the relatively small single-slot plating of the total surface area of the piece on the larger, so that when plating the small pinhole pieces, if the single-slot plating pieces are more. The original anode area is not enough. Especially when the platinum-titanium mesh use time is too long platinum loss is too much, the effective area of the anode will be reduced, which will affect the deep plating ability of the gold plating, plating pieces of holes will not be plated into the hole. 10. poor combination of plating in the plating inspection of the plug-in plating combination, sometimes encountered in some of the pins of the pin end of the front in the bending or the pinhole pieces of the weld line holes in the flattening of the phenomenon of peeling plating layer, and sometimes in the high temperature (2000 hours) test test found that the gold layer has been peeling, and sometimes in the high temperature (2000 hours) test found that the gold layer is not enough. Sometimes in the high temperature (2000 hours) test test found that the gold layer has a very small bubble phenomenon occurs.11. Pre-plating treatment is not complete for small pinhole parts, if in the machining sequence after the completion of the ultrasonic degreasing can not be used immediately after the trichloroethylene cleaning, then the next conventional pre-plating treatment is difficult to remove the oil inside the holes of the dry, so that the holes in the plating of the bonding force will be greatly reduced. 12. 12. Incomplete activation of the substrate before plating in the base material of the connector using a large number of various types of copper alloys, these copper alloys of iron, lead, tin, beryllium and other trace metals in the general activation of the solution is difficult to make it activated, if the corresponding acid will not be used to activate, in the electroplating, the oxides of these metals and the plating layer is difficult to combine, which results in the phenomenon of high-temperature blistering of the plating layer. 13. The plating concentration of the low ammonia in the use of nickel sulfonate plating solution. Sulfonic acid nickel plating solution nickel plating, when the nickel content is lower than the process range, small pinhole parts of the hole plating quality to be affected. If the gold content of the pre-plating solution is too low, then in the plating of gold holes may not be plated gold, when the plated parts into the thickening of the gold plating solution, holes in the hardware layer of the plated parts holes in the nickel layer has been passivated as a result of the holes in the gold layer of the combination of the natural poor. 14. elongated pin plating did not reduce the current density in the plating of elongated shape pins, if usually used in accordance with the remote current density plating, the tip of the needle tip parts of the plating will be much thicker than the needle bar, under a magnifying glass, the plated parts will be much thicker than the needle bar. The tip of the needle is much thicker than the stem, and the tip of the needle is sometimes shaped like a match head when viewed under a magnifying glass. The head and neck of the plating that is the top of the front of the pin back a little bit of the parts of the gold plating test bonding is not qualified. This phenomenon is easy to appear in the vibration gold plating. 15. vibration gold plating vibration frequency adjustment is not correct using vibration plating plating connector, if the nickel plating vibration frequency adjustment is not correct plating jump too fast, easy to open into a double layer of nickel on the plating of the bonding effect is very large.

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