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Molex Introduces Impact zX2 Backplane Connectors for High-Speed Applications

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Molex introduces the Impact zX2 backplane connector system, which delivers industry-leading speed and signal integrity (SI) performance while supporting data rates up to 28 Gbps in a modular design. The system utilizes Impel's ground shield and footprint technology to enhance SI performance. Customers seeking to upgrade their line cards to meet increasing data rate requirements can now do so without major modifications to their existing infrastructure. The zX2 system is backward compatible with standard Impel connectors, allowing current users of Impel products to preserve their existing architectures while upgrading the data rates of their own racks.

We have been seeing steadily increasing data rate requirements driving developers of datacom equipment to introduce faster and faster systems," said Liz Hardin, product manager, Molex. "The Impact connector system allows customers to introduce high density connector solutions into their designs. The signal integrity of the Impact zX2 is optimized to support more stringent signal loss requirements, allowing customers to extend the life of the Impact chassis. The base-alike construction improves crosstalk isolation and increases NEXT margins. Discontinuities can be minimized through the signal path by reducing the functional impedance to a lower value of 95 ohms. Reduced-size compliant pins (0.36 mm) on the backplane and daughtercard optimize the size of the printed circuit board and help to reduce impedance over the volume, further enhancing the SI performance of the connector system.The upgraded version of Impact, Impact zX2, is ideal for use in a wide range of markets, including telecom, data/computing, aerospace and defense, and medical.

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