Categorization：Product Information
ICCON Low-Profile Pins and ReceptaclesTE Connectivity's Pins and Receptacle Products Can Be Used in Orthogonal Applications with Solder MountingTE Connectivity AMP's ICCON Low-Profile Pins and Receptacles Picture TE Connectivity's ICCON low-profile power pins and receptacles offer scalable design options and space savings for efficient installation in applications up to 35 A applications. These ICCON Low-Profile products require no tools for installation or removal and are also suitable for solder paste (PIP) reflow processes. Expandable design options offer a variety of positions to choose from, including 4-position, 6-position, and 8-position. The compact, low-profile design saves space, and they can be used in orthogonal applications with solder mounts.
1, TE|ICCON Thin-Pin and Receptacle Connector Related Characteristics Table:
| Pros. | Electrical Characteristics |
| Expandable design options provide multiple position choices: 4-position, 6-position, and 8-position; solder-mounted orthogonal applications; 35 amps/pin | LLCR: 1 MΩ (larger values) |
| Easy installation reduces the number of tools required to install or remove ICCON slim products | Current: 35 A/position |
| For solder paste (PIP) reflow processes | mechanical property |
| Compact design offers low-profile space savings | Durability: 200 cycles |
| Pin Diameter: 2.4 mm | |
| Material parameters. | Target Markets. |
| copper alloy | Data communications (telecommunications) |
| appliance | industrial application |
| router (computing) | Testing and metrology |
| server (computer) | |
| storage device (computer) | |
| cordless |
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