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Amphenol|Amphenol|Amphenol ConnectorsInfineon®

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Specializing in the sales of: Connectors | Wire Harness | Cable Products

Amphenol|Amphenol|Amphenol Connectors Infineon® products are a: Improve performance and differential pair signaling with InfinX®! High-speed snap-in board connector system is designed to meet the needs of 25+ Gbps applications.Available in 4- and 6-pair configurations, InfinX is a better choice for high-speed board-to-board applications. Available in 85 and 100 ohm versions, InfinX supports stackups from 10 mm to 42 mm high, and its patented resonance suppression technology is unmatched in reliability.InfinX is a dedicated solution for enhancing differential pair signals. With up to 66 pairs per linear inch (26 pairs per linear centimeter) of high-density pin sheets, it is designed for standard SMT processes. Although rated at a bandwidth of 25 Gbps, InfinX can carry higher data rates. Data rates can be as high as 28 Gbps and is limited only by the underlying SMT intrinsic substrate, InfinX is available in 4- and 6-pair options, with stack heights from 10 mm to 42 mm, making it flexible enough to match a wide range of designs. With its unique "in-ball blade" connection technology, InfinX ensures BGA connectivity and high process yields.

-1, Amphenol | Amphenol | Amphenol Connector Infineon ® material number / type breakdown:

Amphenol|Amphenol|Amphenol Connectors Infineon® Part Number / Model Number
379-3334-200380-5332-20W380-5491-20W380-5541-200
379-3336-200380-5341-200380-5492-200380-5541-20W
379-3365-200380-5341-20W380-5492-20W380-5571-200
379-3366-200380-5342-200380-5532-200380-5571-20W
379-3385-200380-5342-20W380-5532-20W380-5591-20W
379-3386-200380-5343-20W380-5541-200380-3326-20W
379-3396-200380-5371-200380-5541-20W380-3426-20W

2, Amphenol|Amphenol|Amphenol Connector Infineon® features and benefits:

characterizationvantage
Supports 10 to 25+ Gbps performanceProvides system designers/architects with multiple data rate options and migration paths for future applications
Product differential pair density is higher than currently availableExtremely dense to improve differential performance and reduce crosstalk and signal loss
Stack heights from 10 mm to 42 mm and a wide range of module sizesProvides system designers with great flexibility to meet stringent board-to-board requirements
Utilizes Amphenol's patented resonance suppression technologyProvides better signal fidelity for the industry's snap-in connectors
" "In-Ball Blade" BGA ConnectionReduces connector assembly tolerances to lower tolerances and improves yield of SMT board assemblies

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