Amphenol|Amphenol|Amphenol Connectors HCI® High Power Supply Power Connectors

Amphenol|Amphenol|Amphenol Connector HCI® The HCI® high power supply power connector product is one of a kind: the HCI® High Power Supply Power Backplane/Midplane Connector Series meets the needs of many applications, such as higher power solutions for the interface between daughter cards and backplanes or midplanes in rackmount equipment application platforms. The high density, compact modules provide reliable quality and effective low cost through stamped and molded terminal technology, HCI power terminal technology, providing greater linear power density to the daughter card edge. The modular design provides power solutions with different pin counts such as 2-pin and 3-pin. hci High Power Power Modules are rated up to 113A per terminal with a temperature rise of no more than 30°C in still air without a fan. these modules meet the current density requirements of more than Amphenol ICC's other hard metric high-power power supply power connector system, these high-power power supply connectors are designed to mate with other meet hard metric (HM) backplane/midplane connector series, such as the Amphenol ICC's high performance AirMax VS® and ZipLine™ connector systems or Millipacs®. 2 mm HM connectors. In fact, the ZipLine mates with HCI's high power power connectors for an even higher signal and power density portfolio on the market. Each power pin is surrounded by a plastic shell that provides significant safety against shorting to adjacent power terminals. Ventilation is provided by designing ventilation holes above and below the plastic housing on the power pins to reduce the heat generated by the connector in the application.

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