Categorization:Product Information
Amphenol|Amphenol|Amphenol Connectors cStack™ The Flex cable product is a: interposer-based flexible assembly, customized for board-to-board applications, Amphenol cStack™ Flex circuit assemblies are designed for applications where flexibility, space, weight and performance are critical. Standard and customized flexible circuit and connector designs are available. cStack™ Flex is a press-fit interconnect. Flex is a crimp interconnect system utilizing Amphenol cStack™ interposers to terminate multi-layer impedance controlled flexible circuits in compact packages. The flexible cable assembly is designed to meet unique signal integrity, mechanical, power and environmental requirements. cStack™ Flex cables are suitable for a wide range of commercial and military applications and have been deployed in the field for over 15 years. Space saving, full airflow, lower signal loss and better stability than PCB-based solutions, crimp method for lower mating heights, support for mezzanine and coplanar applications.
-1, Amphenol | Amphenol | Amphenol Connector cStack ™ Flex cable material number / model breakdown:
Amphenol|Amphenol|Amphenol Connector cStack™ Flex Cable Part/No. | |||
9952-015<. /td> | 9952-025 | 9952-045 | |
9952-010 | 9952- 020 | 9952-030 | 9952-050 |
2. Amphenol|Amphenol Connector cStack™ Flex Cable Features and Benefits:
Features | Benefits | |
3D Interconnection | Unique Packaging Solutions Unavailable With Other Technologies The newest and most advanced technology in the industry, the Polyimide Flex, saves space by bypassing obstacles and ensures full airflow | |
Polyimide Flexible material | Lower signal loss and better temperature stability than FR4 | |
cStack interpolators utilize compression terminals, allowing for lower mating heights | 1.22mm mating height for superior performance | |
/lt;/td> Multiple signal loss options are available. gt;Multiple impedance values available | Optimized to meet a wide range of SI requirements | |
Thinner, lighter, and denser than cable or rigid boards | Reduced space and weight | |
Multi-layer construction including three copper layers or more | Optimized routing, impedance and SI performance |