Board-to-Board Connector Development Status

Board-to-board connector development status in-depth analysis. At this stage, the cell phone using the board-to-board connector, the key has the following characteristics: first of all, "soft", flexible connection, and has a strong corrosion resistance; then is not welding welding, assembly is convenient and fast, and will not cause a fire safety hazards, so that also saves space; However, nowadays the board to board are very low height, double Built-in type, this point below, I will be key to describe; ultimately have a strong resistance to ring mirror, not only soft, and choose to touch the high stability of the "firm connection"; naturally, generally also has no separation of the pipe fittings, with pressure blocking, easy and fast assembly and other advantages. In order to enhance the composition force of the power socket and the socket, a simple snap-locking organization is selected in the fixed metal product part and the contact point part, and at the same time of enhancing the composition force, the locking is made to have more of a sense of realism when it is plugged in. The connector can minimize the thickness of the product to achieve the purpose of connection, which has more and more ultra-thin cell phones on the market!

Narrow spacing board-to-board connectors, 0.35mmpitch at this stage is mainly used in the iPhone and China's high-grade models, it is used may be the big development trend in recent years, it has the volume of at least, the greatest precision, excellent performance and other advantages, but the demand for SMD and other collocation with the processing process is higher, which is the most important need for many connector manufacturers online customer service area, otherwise the product qualification rate will be very Low. In the customer for the product thickness, tactile feeling of the provisions of the increasingly high today, thin, ultra-narrow connectors on the plating clearly put forward a new provision, in the combined height of 0.6mm, a separate product is not enough 0.4mm height of the product, how to ensure that the product plating thin and thick and on the effect of tin does not climb the tin, into the connector miniaturization of the most critical problems, the field at this stage of the widespread practice of the plating of the plating layer detachment to block the way to tin. At this stage, the field is widely practiced through the laser will be electroplated gold layer detachment to block the way on the tin, and then deal with the problem of not climbing tin, but this technology has a defect, that is, stripping the gold, the laser will be the same as the damage to the nickel plating layer, which will expose the copper in the gas, and then leaching and rusting. One thing to mention now is that board-to-board connectors are able to carry out the simple structure of the device circuit principle. According to the bottom edge of the connector to set the wall of the insulation layer, so that the PC board wiring and metal material terminals do not carry out the touch can be carried out in the bottom edge of the connector wiring wiring for PC board miniaturization is very advantageous!

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