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I-PEX NOVASTACK® 35-HDP fully shielded board-to-FPC connectors provide excellent EMC shielding performance, giving engineers more flexibility in designing boards for high-performance electronic devices. NOVASTACK® 35-HDP: For 5G mmWave antenna modules and devices, fully shielded and narrow design, power supply with Coulson alloy terminals, 0.35 mm pitch, height 0.7 mm.
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power supply terminal
High-performance EMC shielding design I-PEX has developed a connector series that solves the problem of electromagnetic noise in connectors with suitable grounding structures and coverings, including mounting positions at the end of signal terminals with metal shielding (ZenShield®). This solution is widely adopted by many customers to prevent electromagnetic interference, especially in high-performance devices equipped with wireless communication features such as Wi-Fi, GPS, LTE, etc. The 360-degree EMC shielding design prevents electromagnetic noise radiation not only from the contact points of male and female chassis connectors, but also from the mounting portion of the circuit board at the signal terminals (SMT location). In addition, the male and female chassis shields are properly connected for multi-point grounding when the connector is nested and properly grounded to the circuit board. This ensures that there is an adequate ground return path for the current generated in the metal shield of the connector. This is to suppress electromagnetic noise emanating from the shield. -The entire connector is shielded 360 degrees, including the male and female chassis.
-Shield-Shield interface between male and female chassis connectors for efficient connection at multiple points.
-The connector shield-circuit board interface is effectively grounded at multiple points, resulting in an improved ground return path.
With these design features, the connectors themselves provide significant EMI mitigation. zenShield® provides engineers with greater flexibility in designing circuit boards, and it makes it possible to locate the connectors close to sensitive subsystems, such as transmit/receive antennas, which are common in high-performance wireless communication systems.
Automated manufacturing and inspection processes
Narrow ZenShield® board to FPC connector NOVASTACK® 35-HDN: for 5G mmWave antenna modules and devices, fully shielded and narrow design, power supply with Coulson alloy terminals, 0.35 mm pitch, height 0.7 mm
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