Categorization：Product Information
MIL-HD2 SOSA™/VITA 91 Compliant Connector SeriesAmphenol Aerospace Operations' connector series is designed to fulfill 56 G PAM4 data rate requirements at higher densitiesAmphenol Aerospace's MIL-HD2 SOSA™/VITA 91 Compliant Connector Series Pictures Amphenol Aerospace has developed MIL-HD2 for compliance with the Sensor Open Systems Architecture™ (SOSA technical standard). MIL-HD2 provides developers with a ready-to-use, robust open architecture solution for more compact card spacing and chassis designs where space requirements and density are critical. and chassis designs where space requirements and density are critical. Available in 3-, 4- and 6-pair configurations, these connectors provide the largest number of differential pairs in 3U configurations in the MIL embedded market today at 56 Gb/s PAM 4 speeds. This series has been selected by the SOSA Alliance to provide a SOSA compliant solution for next generation switch and payload card requirements, enabling the MIL embedded market to meet next generation performance levels while remaining COTS compliant.
1、Amphenol Aerospace/MIL-HD2 SOSA™/VITA 91 compliant connector related characteristics table:
| Characteristics: | Applications: |
| Configuration to meet SOSA/VITA 91 HD switch requirements | Ground Combat System |
| Quad Differential, Eight Columns - SOSA Compliant Configuration | Commercial and military aerospace |
| Scalable data rates up to 56 Gb/s PAM4 to support system upgrades without costly redesigns | missile defense |
| Proprietary crosstalk reduction technology | Space data centers and other space systems |
| 15.7 mil drill-compatible pin allows for deeper back drilling | Radar and sonar equipment |
| Optimized substrate surfaces | Intelligence, surveillance and reconnaissance systems |
| Shielded contacts are mated before signal contacts, providing up to 4 mm of friction distance. | Sensors, switches and integrated processors |
| Provision of embedded capacitors | Electronic warfare (EW) and C5ISR systems |
| 28-84 differential pairs per inch (11-33 differential pairs per centimeter) | embedded computing |
| Maximum density at 1.80 mm pitch | phased array radar (computing) |
| Proven EMI and signal integrity benefits | single processor computer (CPU) |
| Improved impedance matching | |
| Complete solutions for unique customer needs | |
| Supports hot-swapping | |
| Meeting the demands of high-density applications |
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