Categorization:Product Information
Amphenol | Amphenol Connectors-AgilBrick ™ 2.00 mm Wire-to-Board Base The G823 series connector product is a: Customizable shielded wire-to-board base AgilLink ™ 2.00 mm wire-to-board base The G823 series is a widely used connectivity solution for power and signal transmission. This series of bases is suitable for wire-to-board and board-to-board applications and has a maximum current rating of 4A. Amphenol offers a full range of products, including V/T DIP, V/T SMT, R/A DIP, to meet various customer needs. Support for customizable pin lengths, including contact pins and solder tails, provides an ideal connection solution for a variety of applications and specific designs. Provides flexible and easily modifiable pin lengths for a variety of applications Cost-effective for wire-to-board and board-to-board applications Supports PIP processes Easily plugged and securely connected to PCB boards.
-1. Amphenol | Amphenol Connector-AgilBrick ™ 2.00mm Wire-to-Board Base G823 Series Connectors Part/Model List:
Amphenol | Amphenol Connectors-AgilBrick ™ 2.00 mm Wire-to-Board Base G823 Series Connectors Part/Model | |||
G8230412YBEU | G8232012YBAEU | G861B10112T9P1HR | G862H025T3HR |
G8230413YBTHR | G8232012YBEU | G861B10212T9P11HR | G862H026T3HR |
G8230612YBEU | G8232012YBPEU | G861B10212T9P21HR | G862H032T3HR |
G8230612YBTHR | G8232012YC19EU | G861B10212T9P2HR | G862H033T3HR |
G8230613YBTHR | G8232012YCAHR | G861B10213T9HR | G862H041AEU |
G8230614YB1EU | G8232013YBEU | G861E02211THR | G862H041TEU |
G8230614YBPEU | G8232013YBTHR | G861E05211THR | G862H102T3HR |
-2. Amphenol | Amphenol Connectors-AgilBrick ™ 2.00 mm Wire-to-Board Base G823 Series Connectors Features and Benefits:
Characteristic | Advantage |
Customizable pin lengths available, including contact pins and solder tails | Suitable for different applications and specific designs |
Various mounting options are available, including vertical DIP, right-angle DIP, vertical SMT, and right-angle SMT | Enables easy selection of board mating configuration |
Thermoplastic material with high temperature resistance | Support reflow soldering |
Volumes are available as options | Support PIP process |
RoHS compliant, halogen free | Compliance with environmental, health and safety requirements |
Elevated design | Convenient PCB cleaning |
Meets USB2.0 and USB3.0 signaling requirements | Capable of meeting 3G and 5G speed requirements |
Compatible with wire-to-board mount G862 ® and board-to-board mount G827 | Suitable for both wire-to-board and board-to-board applications |
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