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Amphenol|Amphenol|Amphenol Connectors cStack™ Flex Cable Profile and Model Details

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Specializing in the sales of: Connectors | Wire Harness | Cable Products

Amphenol | Amphenol Connector cStack ™ Flex Cable is an interposer-based flexible assembly designed for board-to-board applications. Amphenol cStack ™ Flex Circuit Assemblies are designed for applications where flexibility, space, weight, and performance are critical. Standard and custom flex circuit and connector designs are available. The cStack ™ Flex is a crimp interconnect system that utilizes Amphenol cStack ™ interposers to terminate to multilayer impedance controlled flex circuits in a compact package. Flexible cable assemblies are designed to meet unique signal integrity, mechanical, power, and environmental requirements. CStack ™ Flex cables are suitable for a wide range of commercial and military applications and have been deployed in the field for over 15 years. Space-saving, high airflow, lower signal loss and better stability than PCB-based solutions, crimp for lower mating heights, support for mezzanine and coplanar applications.

-1. Amphenol | Amphenol | Amphenol Connector cStack ™ Flex Cable Item/Model List:

Amphenol | Amphenol Connector cStack ™ Flex Cable Part/Model
9952-0059952-0159952-0259952-045
9952-0109952-0209952-0309952-050

-2. Amphenol | Amphenol | Amphenol Connector cStack ™ Flex Cable Features and Benefits:

Characteristic Advantage
Three-dimensional interconnectionWith a unique packaging solution that no other technology can provide, obstacles can be avoided, space can be saved, and air circulation can be fully guaranteed.
Polyimide flexible materialLower signal loss and better temperature stability compared to FR4
The cStack interposer uses compression terminals to allow for a lower mating height1.22 mm mating height for superior performance
Multiple impedance values availableOptimized to meet a wide range of SI requirements
Thinner, lighter, and denser than cable or rigid boardReduce space and weight
Multilayer structure comprising three copper layers or moralOptimize routing, impedance, and SI performance

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