Categorization：Product Information
Amphenol | Amphenol Connectors Infineon ® products are: For increased performance and differential pair signaling, the InfinX ® High-Speed Gusset Connector System is designed to meet the needs of 25 + Gbps applications. InfinX is available in 4-pair and 6-pair configurations and is the best choice for high-speed board-to-board applications. In 85 and 100 Ohm versions, InfinX supports stacks from 10mm to 42mm high, and its patented resonance suppression technology is extremely reliable. InfinX is a dedicated solution to enhance differential pair signals. High density of up to 66 pairs of pins per linear inch (26 pairs per linear centimeter) designed for standard SMT processes. Although the rated bandwidth is 25 Gbps, the InfinX can carry higher data rates. Data rates of up to 28 Gbps are possible and are only limited by the underlying SMT native substrate. InfinX is available in 4 and 6 pairs, with a stack height of 10mm to 42mm, which is flexible enough to match many designs. With the unique "blade in ball" connection technology, InfinX ensures accurate BGA connections and high process yields.
---------------------------1. Amphenol | Amphenol Connector Infineon ® Part Number/Model List:
| Amphenol | Amphenol Connectors Infineon ® Part No./Model | |||
| 379-3334-200 | 380-5332-20W | 380-5491-20W | 380-5541-200 |
| 379-3336-200 | 380-5341-200 | 380-5492-200 | 380-5541-20W |
| 379-3365-200 | 380-5341-20W | 380-5492-20W | 380-5571-200 |
| 379-3366-200 | 380-5342-200 | 380-5532-200 | 380-5571-20W |
| 379-3385-200 | 380-5342-20W | 380-5532-20W | 380-5591-20W |
| 379-3386-200 | 380-5343-20W | 380-5541-200 | 380-3326-20W |
| 379-3396-200 | 380-5371-200 | 380-5541-20W | 380-3426-20W |
-------------------------------2. Amphenol | Amphenol Connector Infineon ® Features and Benefits:
| Characteristic | Advantage |
| Supports 10 to 25 + Gbps performance | Provide system designers/architects with multiple data rate options and migration paths for future application |
| The product differential pair density is the highest at present. | Maximum density improves differential performance, reduces crosstalk and signal loss |
| Stack height from 10 mm to 42 mm and available in a variety of module sizes | Gives system designers great flexibility to meet stringent board-to-board requirements |
| Patented resonance suppression technology from Amphenol | Provides the highest level of signal fidelity for the industry's gusset plate connectors |
| Blade in Ball BGA Connection | Minimize connector assembly tolerances and increase SMT board assembly yield |
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