Categorization:Product Information
Amphenol Amphenol Connector AgilLink ™ 2.00 mm Wire-to-Board Base G823 is a: Customizable shielded wire-to-board base, AgilLink ™ 2.00 mm wire-to-board base G823 series is a wide range of connectivity solutions for power and signal transmission. This series of bases is suitable for wire-to-board and board-to-board applications with a maximum current rating of 4A. Amphenol offers a full range of products, including V/T DIP, V/T SMT, R/A DIP, to meet a variety of customer needs. Customizable pin lengths are supported, including contact pins and solder tails, providing ideal connection solutions for a variety of applications and specific designs. Offers flexible and easily changeable pin lengths to meet a variety of application needs, is extremely cost-effective, suitable for wire-to-board and board-to-board applications, supports PIP process, and makes it easy to plug in and establish a robust connection to PCB boards.
--------------------------------------------------------------------1. Amphenol Amphenol Connector AgilLink ™ 2.00 mm wire-to-board base G823 material number/model list:
Amphenol Amphenol Connector AgilLink ™ 2.00 mm Wire-to-Board Base G823 Material Number/Model | |||
G8230412YBEU | G8230612YBTHR | G8230614YBPEU | G8230810YBTHR |
G8230413YBTHR | G8230613YBTHR | G8230614YBTHR | G8230812YBEU |
G8230612YBEU | G8230614YB1EU | G8230623YBEU | G8230812YBPEU |
-------------------------------------------------------------------------2. Amphenol Amphenol Connector AgilLink ™ 2.00 mm Wire-to-Board Base G823 Features and Advantages:
Characteristic | Advantage |
Customizable pin lengths available, including contact pins and solder tails | Suitable for different applications and specific designs |
Various mounting options are available, including vertical DIP, right angle DIP, vertical SMT, and right angle SMT | Supports easy selection of board matching configuration |
High temperature resistant thermoplastic material | Supports reflow soldering |
Roll Options Available | Supports PIP process |
RoHS compliant, halogen-free | Meets environmental, health and safety requirements |
Elevated design | Convenient PCB cleaning |
Complies with USB2.0 and USB3.0 signal requirements | Able to meet 3G and 5G speed requirements |
Can be matched with the wire-to-board base G862 ® and the board-to-board base G827 | Suitable for both wire-to-board and board-to-board applications |
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