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Amphenol|Amphenol|Amphenol Connectors AgilLink™ 2.00 mm Wire-to-Board Chassis G823 Introduction and Model Number Details

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Specializing in the sales of: Connectors | Wire Harness | Cable Products

Amphenol Amphenol Connector AgilLink ™ 2.00 mm Wire-to-Board Base G823 is a: Customizable shielded wire-to-board base, AgilLink ™ 2.00 mm wire-to-board base G823 series is a wide range of connectivity solutions for power and signal transmission. This series of bases is suitable for wire-to-board and board-to-board applications with a maximum current rating of 4A. Amphenol offers a full range of products, including V/T DIP, V/T SMT, R/A DIP, to meet a variety of customer needs. Customizable pin lengths are supported, including contact pins and solder tails, providing ideal connection solutions for a variety of applications and specific designs. Offers flexible and easily changeable pin lengths to meet a variety of application needs, is extremely cost-effective, suitable for wire-to-board and board-to-board applications, supports PIP process, and makes it easy to plug in and establish a robust connection to PCB boards.

--------------------------------------------------------------------1. Amphenol Amphenol Connector AgilLink ™ 2.00 mm wire-to-board base G823 material number/model list:

Amphenol Amphenol Connector AgilLink ™ 2.00 mm Wire-to-Board Base G823 Material Number/Model
G8230412YBEUG8230612YBTHRG8230614YBPEUG8230810YBTHR
G8230413YBTHRG8230613YBTHRG8230614YBTHRG8230812YBEU
G8230612YBEUG8230614YB1EUG8230623YBEUG8230812YBPEU

-------------------------------------------------------------------------2. Amphenol Amphenol Connector AgilLink ™ 2.00 mm Wire-to-Board Base G823 Features and Advantages:

CharacteristicAdvantage
Customizable pin lengths available, including contact pins and solder tailsSuitable for different applications and specific designs
Various mounting options are available, including vertical DIP, right angle DIP, vertical SMT, and right angle SMTSupports easy selection of board matching configuration
High temperature resistant thermoplastic materialSupports reflow soldering
Roll Options AvailableSupports PIP process
RoHS compliant, halogen-freeMeets environmental, health and safety requirements
Elevated designConvenient PCB cleaning
Complies with USB2.0 and USB3.0 signal requirementsAble to meet 3G and 5G speed requirements
Can be matched with the wire-to-board base G862 ® and the board-to-board base G827Suitable for both wire-to-board and board-to-board applications

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