Categorization：Product Information
Molex's 3rd generation C-Grid III 2.54 mm pitch post and socket interconnect system provides comprehensive design flexibility and modular components to replace a wide range of electronic packaging devices. C-Grid III is a highly versatile 2.54 mm interconnect system with unique design features. Finish: C-Grid III features a standard 3-coat finish. Two optional gold performance levels and one optional tin performance level, both with a nickel-plated base, are guaranteed to give you the best value for money for your application. Flexible: C-Grid III has been carefully developed to meet the latest industry requirements. Three different termination technologies (solder tail, crimp and insulation puncture) are combined within a complete interconnection system and are based on the north/south contact orientation. Both discrete wire and ribbon cable connectors can be connected to the needle hub. Design advantages: The C-Grid III cartridge contact design uses the same mating concept and uses all termination technologies. All contacts adopt a uniform locking system, so they can be completely interchanged in different styles of housings. Interchangeability: C-Grid III is fully compatible with industry standard DIN41651 as well as HE-13/14 French standard. In addition, the device is intermatchable and interchangeable with Molex's QF-50 product family. Lower application costs: The C-Grid III system combines a vast array of advanced application tools, from hand-operated tools to semi-automatic wire harness making machines. C-Grid III has become the most extensive alternative to interconnected packaged devices in today's electronics market.
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1. MolexC-Grid III interconnection system connector related characteristics table:
| Spacing: | |
| 2.54 mm | |
| Current: | |
| 3.0 A (Max) | |
| Number of circuits: | |
| 1 to 80 |
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