Categorization:Product Information
zSFP + Stacked Interconnect Devices TE's zSFP + Stacked Interconnect Devices accommodate three rows of interconnected applications to increase density and maximize PCB space savings TE's zSFP + Stacked Interconnect Devices are designed for up to 56 Gbps PAM-4 Transfer data rates while providing high panel density for hyperscale data center and network switch applications. In addition, users can design data rates from 10 Gbps to 16 Gbps in the zSFP + connector to gradually establish higher speed paths. This scalability saves long-term costs because it then eliminates the need for a complete redesign to achieve higher performance. The stacked portfolio accommodates three rows of intermount applications to increase density and maximize PCB space savings.
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1. TEzSFP + stacked interconnect device related characteristic table:
Features: | Main advantages: |
Data rates: up to 28 Gbps NRZ and 56 Gbps PAM-4, 10 Gbps Ethernet, and 16 Gbps Fibre Channel | Each product in TE's SFP I/O interconnect portfolio is designed to transmit data at speeds up to 28 Gbps NRZ and 56 Gbps PAM-4 signals |
Surface Mount Connector Design for Single Height 1xN Cages | Stacked portfolio accommodates three rows of intermount applications to increase density and maximize PCB space savings |
Press-fit 1xN cages and stacked assemblies (connectors and cages) for easy PCB placement in one step | Shares the same mating interface and cage size as the entire SFP28 portfolio |
Coupled, narrow edge, blank, formed contact beam geometry and insert molding for excellent signal integrity, mechanical and electrical performance | Allows easy upgrade path from 28 Gbps to 56 Gbps applications |
Backward compatibility: Share the same mating interface and cage size as SFP + connectors (connector/single height cage is also compatible with PCB size) | Enhanced airflow cage design provides excellent thermal performance and can be customized to meet customer LED light pipe requirements |
EMI sealed elastic gasket or spring finger option | Application: |
Single high cage (1xN), providing design flexibility; Adapt to intermount applications to increase density and save PCB space; Available in 1x1, 1x2, 1x3, 1x4, or 1x6 port configurations | Switch |
Stacked assemblies available with 2x1, 2x2, 2x4, 2x6, 2x8, or 2x12 ports | Server |
Heat sink, LED and plating options available | Router |
Other Light Pipe Configurations Available | Storage |
Test Equipment | |
Data center | |
network |
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