Board-to-Board Connector-Amphenol Board-to-Board Connector product features and advantages and other related introduction

What is a board-to-board connector? : The board-to-board connector establishes a signal connection between two printed circuit boards (PCBs) without the need for cables. World Trade Electronics offers a wide variety of board-to-board options to meet your specific needs, allowing you to design connectors as you wish and achieve ideal performance in every application scenario. -Connecting two sub-plugins via a universal PCB on the back of the base to form a backplane system. The right-angle connectors on each sub-insert board are connected to the backplane via vertical connectors. Backplanes are common in top-of-rack switch applications or HHD clusters. Coplanar-Two PCB boards are located on the same plane and connected by two right-angle connectors. Orthogonal-Two connected PCB boards remain orthogonal to each other. This helps to improve airflow and is extremely practical in modern network configurations that achieve ridge-leaf structures. Sandwich-Two connected printed circuit boards are kept parallel at a fixed distance. Signal-Universal Connector. The hallmark of this type of connector is that it provides an open pin area, which is typically suitable for low voltage and low current application scenarios. In the open pin area, each pin provides an independent connection, and the signal and ground modes can be determined by the end user. Therefore, such connectors can be suitable for most applications, but may not be suitable for high-performance applications. But the Bergstak is a unique product in this category that supports high-speed signal transmission. Card Edge-Only one connector is needed as the male connector will be constructed from plated pads on the PCB board. Similar to the connection method in PCIe, the card edge PCB can be connected vertically to the main PCB board, or it can be connected in a coplanar configuration.

-------------------------------------------------------------------------------------------------------------------------------------------------------------1. What are the advantages of Amphenol boards to board connectors? ：

1.1. Signal integrity: The term signal integrity is used to describe the electrical performance quality of interconnects. The electrical performance quality of the interconnect is related to power loss, reflection, and crosstalk. The power loss of the interconnect is quantified as "insertion loss", i.e. the power lost by the signal in the process of passing through the interconnect. The reflection is quantized as "return loss", i.e. the power reflected from the interconnect back to the transmitter. Crosstalk refers to the noise generated by other neighboring signals that can reduce signal performance. Each metric has design goals related to the application. These applications are typically based on specific protocols or standards. Amphenol offers board-to-board solutions for each industry standard application. XCede and AirMAX are high-performance and proven board-to-board connectors that support backplane, mezzanine, orthogonal or coplanar solutions up to 25Gb/s. Applications for such connectors include IEEE 10GBASE-KR, 25GBASE-KR, OIF CEI-6G, CEI-11G, and CEI-28G. ExaMAX and Paladin are suitable for connectivity application scenarios ranging from 25Gb/s to 112Gb/s. Applicable industry standards for such industry-leading connectors include IEEE 25GBASE-KR, 50GBASE-KR, 100GBASE-KR, OIF CEI-28G, CEI-56G, and CEI-112G. In addition, Amphenol board-to-board connectors are also suitable for PCIe applications for expansion cards or control signals. XCede and AirMAX are available for PCIe Gen 1, 2 or 3. ExaMAX and Paladin should be suitable for PCIe Gen 4 or later. Amphenol also offers Millipacs ® Series connectors, a 2.00 mm array interconnect system in a hard metric configuration that meets IEC 917, IEC 61076-4-101, Telcordia GR-1217-CORE standards and meets Compact PCI bus architecture requirements. Built-in rich features for stable operation in harsh environments: twisted pair quincunx contacts, hot-swappable pins of multiple lengths, EMI shielding, coding, guidance, high operating temperature, reliability and durability make it an ideal connection solution in multiple market segments, including industrial, instrumentation, medical, aviation, railway, military, aerospace, automotive and telecommunications. Superior signal integrity also extends to Amphenol board-to-board connectors. Amphenol mezzanine connectors provide industry-leading signal integrity with minimal stack height. The MEG-Array 56 is designed for 56Gb/s connectivity application scenarios with 4mm stack height. Mini-cool Edge is specifically optimized for 112G card edge applications. Amphenol also offers the Cool Edge series of connectors, a high-speed, high-power card-edge connector system that supports most board-to-board application scenarios in the electronics market. This family of multi-purpose solutions complies with a variety of standards, such as PCIe, SAS, SATA, Gen 4/5, OCP 3.0, EDSFF and Gen Z, and is available in a variety of board-to-board configurations such as sandwich, coplanar, mid-board and backplane. In addition, this series of connectors also adopts an open pin area design to support hot plug, making it an ideal solution for application scenarios such as solid-state drives, NVMe SSDs, enterprise data centers, network cards and expansion cards. Amphenol offers a wide range of PCIe ® Gen 4 and Gen 5 vertical connectors, including surface mount, through-hole soldering, crimp and cleat termination options. This series of vertical and right-angle card edge connectors uses 1.00 mm pitch to support signal transmission based on different PCI Express ® specifications on desktop computers, workstations and servers. This connector features a cutting-edge design, and each differential signal pair can support transmission rates of 2.5 GT/s (Gen 1), 5.0 GT/s (Gen 2), 8.0 GT/s (Gen 3) and 16GT/s (Gen 4), and can even be expanded to Gen 5 32GT/s. Finally, the Bergstak ® series is the ideal connection solution that balances cost and performance. This series of connectors supports data rates in excess of 32Gb/s and provides enough pins to transmit high-speed and sideband signals. Offering pitches from 0.4 mm to 0.8 mm, options for 10 to 200 pin positions and flexible stacking spaces from 3 mm to 20 mm, Bergstak ® connectors are dedicated to the industrial, telecommunications, data communications, automotive and medical sectors. This comprehensive product range is also available in a shielded version.

1.2. Density: Density refers to the number of differential pairs and other signals in a unit area. To calculate the density, divide the number of signals from the connector by its footprint. The number of differential pairs per square inch is typically used as a quantitative indicator of density. The density of connectors is directly related to their column spacing and row spacing. The density will increase as the spacing decreases. As the SERDES BGA pitch decreases, it is also the general trend to further reduce the connector pitch. Amphenol offers board-to-board solutions for both low-density and high-density applications. For application scenarios that focus on single-rack separation, AirMAX, XCede and ExaMAX provide powerful solutions that support up to 128 differential pairs in each connector. The BergStak ® 0.8 mm connector is a comprehensive, versatile and flexible solution designed for high-speed and high-density applications. There are also applications that may require high density within the chassis instead of the front panel. For these applications, Amphenol offers fine pin pitch connectors. Representative products include MEG-Array connectors (1mm high-speed signal and ground array interconnect systems) and BergStak connectors with signal pitch of only 0.4 mm.

1.3. Stack height: Stack height refers to the distance between two stacked interconnect boards in mezzanine applications. Backplane connectors suitable for mezzanine applications typically feature stack heights of 15mm to 55mm. Products with such stack heights include ExaMEZZ, InfinX, and GIG-Array. The BergStak ® and BergStik ® product range can cover a wide range from 3mm to 63mm. But there are also many mezzanine connectors specifically designed for ultra-low stack height and ultra-high density application scenarios. Such products include MEG-Array connectors and Chameleon connectors, both of which have minimum stack heights of 4mm and 6mm, respectively. Among them, the Chameleon connectors have a pitch of only 0.9 mm.

1.4. Cost: The interconnection cost can be calculated by piece pricing, which is usually related to the price of each differential pair. Amphenol offers economical and practical low-cost board-to-board solutions. Tried and tested AirMAX and XCede solutions offer data rates up to 25Gb/s and highly competitive pricing. ExaMAX VS is an entry-level solution specifically designed for 25Gb/s applications and can be paired with Amphenol's latest 112Gb/s version of ExaMAX. The BergStak ® Lite 0.8 mm connector is an economical solution with flash gold plating and can be plugged and unplugged up to 50 times, available in 40 to 100-bit gauges (in 20-bit increments) as well as 5mm to 20mm stack height options (in 1mm increments).

1.5. Supply: As a very large-scale (VLS) manufacturer, Amphenol has delivered more than 10 billion differential pairs of connector products to customers around the world. No matter where you are, we have the ability to guarantee batch delivery capabilities.

1.6. Power supply: Many of Amphenol's connectors have built-in integrated power supply solutions, or you can also pair any of our hard metric backplane connectors with hard metric power connectors to achieve more than 100A power supply capability beside high-speed signals. In less demanding mezzanine applications, Chameleon connectors can provide 2.5 A current carrying capacity on each contact. The dual-contact design of the EnergyEdge ™ X-treme connector supports 12V/3000W power supply capabilities and provides linear density second to none in today's market. It has twice the number of contacts than existing card edge products and increases linear current density by 25%. Compared to the eHPCE ®, this series is reduced in size by up to 23% and can carry 3000W in the same 43mm space. This series is available in splint, right-angle, right-angle coplanar and vertical configuration versions.

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