Categorization:Product Information
Amphenol Amphenol connector cLGA ® connector product is a: high-performance, low-cost chip-to-board application Amphenol cLGA ® planar grid array package socket system aims to incorporate traditional connector material structures into high-performance, low-cost chip-to-board applications. Gold-nickel-copper alloy reed contacts guarantee long-term connector performance, contact retention and durability. The cLGA ® socket is widely used in many fields such as portable computer products and supercomputer systems. cLGA ® socket fully complies with Telcordia GR-1217-CORE Specification. The cLGA ® technology can also be used as a cStack ™ board-to-board or flex circuit-to-board stacking connector. With low cost, high signal integrity, and no soldering, the cStack ™ replaces standard two-piece connectors in the above product applications. Data rate: 25Gb/s gold nickel copper alloy reed contacts Telcordia compliant Receptacle for GR-1217-CORE standard.
----------------------------------------------------------------------------------1. Amphenol Amphenol Amphenol Connector cLGA ® Connector Material Number/Model Schedule:
Amphenol Amphenol connector cLGA ® connector material number/model | ||||
10307-001 | 7170-020 | 7500-103 | 7721-001 | 8448-001 |
13465-001 | 7281-001 | 7504-001 | 7886-003 | 8810-001 |
2. Amphenol Amphenol Connector Features and advantages of cLGA ® connector:
Characteristic | Advantage |
Signal integrity data rate up to 25Gb/s, plans to upgrade to 50 + Gb/s in the future | Compact package for excellent performance |
Traditional connector material structure | Guarantee long-term connector performance, contact retention and durability |
Solderless socket termination | Eliminates thermal stress on soldering socket products, allowing for field equipment upgrades |
Patented contact retention technology | Good contact retention |
The housing can be actively stopped when the contact is offset | Provides contact protection against overstress and superior shock and vibration resistance |
Custom and standard molded outer frames | Flexible design according to specific application requirements, or standard frames can be used for cost-effective solutions |
Optional standard housing | Provide customized packaging solutions with low processing costs |
Open pin area design offers differential pair, single-ended, and power contact configurations | Flexible density configuration to support a wide range of applications |
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